3D Ics Market Size, Emerging Trends, Technological Advancements, and Business Strategies 2024-2030

The global 3D Ics market was valued at US$ 7452.9 million in 2022 and is projected to reach US$ 18620 million by 2030, at a CAGR of 14.0% during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.

Market size in 2022

US$ 7452.9 million

Forecast Market size by 2030

US$ 18620 million
Growth RateCAGR of 14.0%Number of Pages200+ Pages

3D IC is a single chip in which all components onthe layers communicate using on-chip signaling, whethervertically or horizontally.

3D ICs refer to three-dimensional integrated circuits where multiple layers of active electronic components are vertically stacked to enhance performance and functionality.

3D Ics Market aims to provide a comprehensive presentation of the global market for 3D Ics, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding 3D Ics. 3D Ics Market contains market size and forecasts of 3D Ics in global, including the following market information:

Global 3D Ics Market Revenue, 2018-2023, 2024-2030, ($ millions)

Global 3D Ics Market Sales, 2018-2023, 2024-2030, (K Units)

Global top five 3D Ics companies in 2023 (%)

There are four ways to built 3D ICs :- 1. Monolithic 2. Wafer on wafer 3. Die on wafer 4. Die on die

We surveyed the 3D Ics manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.

Total Market by Segment:

Global 3D Ics Market, by Type, 2018-2023, 2024-2030 ($ Millions) & (K Units)

Global 3D Ics Market Segment Percentages, by Type, 2023 (%)

  • Beam re-crystallization
  • Wafer bonding
  • Silicon epitaxial growth
  • Solid phase crystallization

Global 3D Ics Market, By Technology, 2018-2023, 2024-2030 ($ Millions) & (K Units)

Global 3D Ics Market Segment Percentages, By Technology, 2023 (%)

  • Through-Silicon Via (TSV)
  • Silicon Interposer
  • Monolithic 3D ICs
  • 2.5D ICs

Global 3D Ics Market, by Application, 2018-2023, 2024-2030 ($ Millions) & (K Units)

Global 3D Ics Market Segment Percentages, by Application, 2023 (%)

  • Consumer Electronics
  • Information and communication technology
  • Transport (automotive and aerospace)
  • Military
  • Others(Biomedical applications and R&D)

Global 3D Ics Market, By Region and Country, 2018-2023, 2024-2030 ($ Millions) & (K Units)

Global 3D Ics Market Segment Percentages, By Region and Country, 2023 (%)

  • North America (United States, Canada, Mexico)
  • Europe (Germany, France, United Kingdom, Italy, Spain, Rest of Europe)
  • Asia-Pacific (China, India, Japan, South Korea, Australia, Rest of APAC)
  • The Middle East and Africa (Middle East, Africa)
  • South and Central America (Brazil, Argentina, Rest of SCA)

Competitor Analysis

The report also provides analysis of leading market participants including:

Key companies 3D Ics revenues in global market, 2018-2024 (Estimated), ($ millions)

Key companies 3D Ics revenues share in global market, 2023 (%)

Key companies 3D Ics sales in global market, 2018-2023 (Estimated), (K Units)

Key companies 3D Ics sales share in global market, 2023 (%)

Further, the report presents profiles of competitors in the market, key players include:

    • XILINX
    • Taiwan Semiconductor Manufacturing Company
    • The 3M Company
    • Tezzaron Semiconductor Corporation
    • STATS ChipPAC
    • Ziptronix
    • United Microelectronics Corporation
    • MonolithIC 3D
    • Elpida Memory


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